Matambudziko muSemiconductor Packaging process

Iwo emazuva ano matekiniki e semiconductor packaging ari kuvandudza zvishoma nezvishoma, asi mwero wekuti otomatiki michina uye matekinoroji anogamuchirwa mune semiconductor packaging inotarisisa kuzadziswa kwezvinotarisirwa mhedzisiro.Iwo aripo semiconductor ekurongedza maitiro achiri kutambura nekuremara, uye mabhizinesi matekiniki haasati ashandisa zvizere otomatiki yekurongedza michina masisitimu.Nekuda kweizvozvo, semiconductor yekurongedza maitiro ayo asina rutsigiro kubva kune otomatiki kudzora matekinoroji anozounza yakakwira yebasa uye mutengo wenguva, zvichiita kuti zviome kune matekinoroji kunyatso kudzora kunaka kwe semiconductor kurongedza.

Imwe yenzvimbo dzakakosha dzekuongorora iko kukanganisa kwemaitiro ekurongedza pakuvimbika kweakaderera-k zvigadzirwa.Kuvimbika kwegoridhe-aluminium bonding wire interface kunokanganiswa nezvinhu zvakaita senguva uye tembiricha, zvichiita kuti kuvimbika kwayo kudzikire nekufamba kwenguva uye zvichikonzera shanduko kuchikamu chayo chemakemikari, izvo zvinogona kutungamira mukudonha mukuita.Naizvozvo, zvakakosha kuti titarise kudzoro yemhando padanho rega rega rekuita.Kugadzira zvikwata zvehunyanzvi zvebasa rega rega kunogona kubatsira kugadzirisa nyaya idzi zvine hungwaru.Kunzwisisa zvikonzero zvezvinetso zvakajairika uye kugadzira zvakanangwa, mhinduro dzakavimbika dzakakosha pakuchengetedza huwandu hwemaitiro emhando.Kunyanya, mamiriro ekutanga ematare ekubatanidza, kusanganisira mapedhi ekubatanidza uye zvinyorwa zvepasi uye zvivako, zvinofanira kunyatsoongororwa.Iyo yekubatanidza padhi yepamusoro inofanirwa kuchengetedzwa yakachena, uye kusarudzwa uye kushandiswa kwekubatanidza waya zvinhu, maturusi ekubatanidza, uye mapeji ekubatanidza anofanirwa kusangana nemaitiro ekuita kusvika pamwero mukuru.Zvinokurudzirwa kusanganisa k copper process tekinoroji neyakajeka-pitch bonding kuti ive nechokwadi chekuti goridhe-aluminium IMC pakuvimbika kwepakeji inosimbiswa zvakanyanya.Kune akatsetseka-pitch bonding waya, chero deformation inogona kukanganisa saizi yemabhora ekubatanidza uye kumisa IMC nzvimbo.Naizvozvo, kusimba kwehutongi hwehutongi panguva yenhanho inoshanda inodiwa, nezvikwata nevashandi vachinyatsoongorora mabasa avo uye mabasa, vachitevera zvinodiwa nemaitiro ekugadzirisa zvimwe zvinhu.

Kuitwa kwakazara kwe semiconductor packaging ine hunyanzvi hunhu.Enterprise matekinoroji anofanirwa kunyatso kutevedzera nhanho dzekushanda dze semiconductor packaging kubata izvo zvikamu nemazvo.Nekudaro, vamwe vashandi vemabhizinesi havashandise akamisikidzwa matekiniki ekupedzisa iyo semiconductor yekurongedza maitiro uye kunyange kuregeredza kuratidza zvakatemwa uye modhi yezvikamu zvesemiconductor.Nekuda kweizvozvo, zvimwe semiconductor zvikamu zvakaiswa zvisizvo, zvichidzivirira semiconductor kuita mabasa ayo ekutanga uye kukanganisa hupfumi hwebhizinesi.

Pakazere, iyo tekinoroji level ye semiconductor packaging ichiri kuda kuvandudza zvakarongeka.Techi mumabhizinesi ekugadzira semiconductor anofanirwa kushandisa nemazvo otomatiki emidziyo yekurongedza masisitimu kuti ave nechokwadi chekusangana kwakaringana kwese semiconductor zvikamu.Vatariri vemhando yepamusoro vanofanirwa kuita ongororo dzakakwana uye dzakasimba kuti vanyatsoona zvisizvo zvakaputirwa semiconductor zvishandiso uye nekukasira kukurudzira matekiniki kuti agadzirise zvinobudirira.

Uyezve, muchirevo chetambo yekubatanidza dhizaini yekudzora kunaka, kupindirana pakati pesimbi simbi uye ILD layer munzvimbo yewaya yekubatanidza inogona kutungamira kune delamination, kunyanya kana waya yekubatanidza padhi uye iyo yepasi simbi / ILD layer inokanganisa kuita mukombe. .Izvi zvinonyanya kukonzerwa nekumanikidzwa uye simba re ultrasonic rinoshandiswa newaya bonding muchina, iyo zvishoma nezvishoma inoderedza iyo ultrasonic simba uye kuiendesa kunzvimbo yekubatanidza waya, ichitadzisa kuparadzaniswa kwegoridhe nealuminium maatomu.Munhanho yekutanga, kuongororwa kweyakaderera-k chip waya bonding inoratidza kuti bonding process paramita inonzwa zvakanyanya.Kana iyo yekubatanidza ma paramita akaiswa zvakanyanya kuderera, nyaya dzakaita senge waya inopwanya uye isina simba mabhondi anogona kubuda.Kuwedzera simba re ultrasonic kutsiva izvi zvinogona kukonzera kurasikirwa kwesimba uye kuwedzera kapu-yakaita deformation.Pamusoro pezvo, iyo isina kusimba yekunamatira pakati peiyo ILD layer uye simbi yesimbi, pamwe neiyo brittleness yezvinhu zvakaderera-k zvinhu, ndizvo zvikonzero zvekutanga zve delamination yesimbi simbi kubva ILD layer.Izvi zvinhu zviri pakati pematambudziko makuru mune yazvino semiconductor packaging process quality control uye innovation.