Front End of Line (FEOL): Kuisa Nheyo

Iyo yekumberi, yepakati uye kumashure inopera yesemiconductor yekugadzira mitsara yekugadzira

Iyo semiconductor yekugadzira maitiro inogona kukamurwa kuita matanho matatu:
1) Pamberi pekupedzisira mutsara
2) Pakati pekupedzisira kwemutsara
3) Kumashure kwekupedzisira kwemutsara

Isu tinogona kushandisa fananidzo yakapusa sekuvaka imba kuongorora iyo yakaoma maitiro ekugadzira chip:

Iko kumucheto kwepamberi kwemutsara wekugadzira kwakafanana nekuisa nheyo uye kuvaka madziro eimba. Mukugadzira semiconductor, nhanho iyi inosanganisira kugadzira zvimiro zvekutanga uye transistors pane silicon wafer.

Matanho akakosha eFEOL:

1.Kuchenesa: Tanga nemucheka wakaonda wesilicon uye uchenese kuti ubvise chero tsvina.
2.Oxidation: Kura chidimbu chesilicon dioxide pawafer kuti uzvitsaure zvikamu zvakasiyana zvechip.
3.Photolithography: Shandisa photolithography kuisa mapatani pawafer, zvakafanana nekudhirowa mapurani nechiedza.
4.Etching: Etch kure zvisingadiwi nesilicon dioxide kuratidza anodiwa mapatani.
5.Doping: Isai tsvina musilicon kuti ichinje maitiro ayo emagetsi, kugadzira transistors, iyo inokosha yekuvaka matombo chero ipi zvayo.

Mid End of Line (MEOL): Kubatanidza maDots

Iyo yepakati yekupedzisira yemutsetse wekugadzira yakafanana nekuisa wiring uye pombi dzemvura mumba. Iyi nhanho inotarisa pakugadzirisa hukama pakati pema transistors akagadzirwa muFEOL nhanho.

Matanho akakosha eMEOL:

1.Dielectric Deposition: Deposit insulating layers (inonzi dielectrics) kuchengetedza transistors.
2.Contact Formation: Form contacts kuti ubatanidze transistors kune mumwe nemumwe uye kunze kwenyika.
3.Interconnect: Wedzera simbi zvidimbu kugadzira nzira dzezviratidzo zvemagetsi, zvakafanana ne wiring imba kuti uve nechokwadi chekusagadzikana kwesimba uye data inoyerera.

Back End of Line (BEOL): Kupedzisa Kubata

Kumashure kwekupedzisira kwemutsara wekugadzira kwakafanana nekuwedzera iyo yekupedzisira kubata kune imba-kuisa zvigadziriso, kupenda, uye kuona kuti zvese zvinoshanda. Mukugadzira semiconductor, iyi nhanho inosanganisira kuwedzera matinji ekupedzisira uye kugadzirira chip yekurongedza.

Matanho akakosha eBEOL:

1.Additional Metal Layers: Wedzera zvidimbu zvakawanda zvesimbi kuti uwedzere kuwirirana, kuve nechokwadi kuti chip inogona kubata mabasa akaoma uye kukurumidza kukurumidza.
2.Passivation: Shandisa zvidziviriro zvekudzivirira kuti udzivirire chip kubva pakukanganisa kwezvakatipoteredza.
3.Kuedza: Isai chip kukuedza kwakasimba kuti ive nechokwadi chokuti inosangana nezvose zvakatemwa.
4.Dicing: Cheka chimedu muzviputi zvega, imwe neimwe yakagadzirira kurongedza uye kushandiswa mumagetsi emagetsi.

Semicera inotungamira OEM mugadziri muChina, yakazvipira kupa yakasarudzika kukosha kune vatengi vedu. Isu tinopa huwandu hwakakwana hwezvigadzirwa zvemhando yepamusoro uye masevhisi, kusanganisira:

1.CVD SiC Coating(Epitaxy, yakajairwa CVD-yakavharwa zvikamu, yakakwirira-inoshanda coating ye semiconductor application, nezvimwe)
2.CVD SiC Bulk Zvikamu(Etch mhete, mhete dzekutarisa, tsika dzeSiC dzemidziyo yesemiconductor, nezvimwe)
3.CVD TaC Yakaputirwa Zvikamu(Epitaxy, SiC wafer kukura, yakakwirira-tembiricha maapplication, nezvimwe)
4.Graphite Zvikamu(Zvikepe zveGraphite, zvimiro zvegraphite zvepamusoro-tembiricha kugadzirisa, nezvimwe)
5.Zvikamu zveSiC(SiC mabhoti, SiC choto machubhu, tsika SiC zvikamu zvepamberi kugadzirisa zvinhu, nezvimwe)
6.Quartz Zvikamu(Mabhoti eQuartz, zvikamu zvequartz zvema semiconductor uye maindasitiri ezuva, nezvimwe)

Kuzvipira kwedu kune kugona kunovimbisa kuti tinopa mhinduro nyowani uye dzakavimbika kune akasiyana maindasitiri, anosanganisira semiconductor kugadzira, advanced materials processing, uye high-tech application. Nekutarisa pakurongeka uye mhando, isu takatsaurirwa kusangana nezvinodiwa zvakasiyana zvemutengi wega wega.