Kudzidza pane semiconductor kufabonding process, kusanganisira adhesive bonding process, eutectic bonding process, soft solder bonding process, silver sintering bonding process, hot pressing bonding process, flip chip bonding process. Mhando uye akakosha tekinoroji zviratidzo zve semiconductor die bonding zvishandiso zvinounzwa, mamiriro ekusimudzira anoongororwa, uye maitiro ebudiriro anotarisirwa.
1 Overview ye semiconductor indasitiri uye kurongedza
Iyo semiconductor indasitiri inonyanyo sanganisira kumusoro semiconductor zvinhu nemidziyo, yepakati semiconductor kugadzira, uye yakadzika maapplication. indasitiri yenyika yangu semiconductor yakatanga kunonoka, asi mushure memakore anoda kusvika gumi ekukura nekukurumidza, nyika yangu yave musika mukuru wepasirese semiconductor chigadzirwa chevatengi uye musika mukuru wepasirese semiconductor michina. Iyo semiconductor indasitiri yanga ichikura nekukurumidza muchimiro chechizvarwa chimwe chemidziyo, chizvarwa chimwe chemaitiro, uye chizvarwa chimwe chezvigadzirwa. Tsvagiridzo ye semiconductor maitiro uye michina ndiyo musimboti wekutyaira wekuenderera mberi kweindasitiri uye vimbiso yeindasitiri uye kugadzirwa kwakawanda kwezvigadzirwa zve semiconductor.
Iyo nhoroondo yekuvandudza ye semiconductor yekurongedza tekinoroji inhoroondo yekuenderera mberi kwekuvandudza kwechip performance uye kuenderera mberi miniaturization yemasystem. Simba remukati rekutyaira rekurongedza tekinoroji rakashanduka kubva kumunda wemafoni ekupedzisira kusvika kuminda yakadai seyepamusoro-inoshanda komputa uye nehungwaru hwekugadzira. Matanho mana ekuvandudza tekinoroji yekurongedza semiconductor anoratidzwa muTafura 1.
Sezvo semiconductor lithography process nodes inofamba ichienda ku10 nm, 7 nm, 5 nm, 3 nm, uye 2 nm, iyo R&D uye mutengo wekugadzira unoramba uchikwira, chiyero chegoho chinodzikira, uye Mutemo waMoore unodzikira. Kubva pamaonero emaitiro ekusimudzira maindasitiri, parizvino akamanikidzwa nemiganhu yemuviri yetransistor density uye kuwedzera kukuru kwemitengo yekugadzira, kurongedza kuri kusimukira munzira yeminiaturization, high density, high performance, high speed, high frequency, uye high integration. Indasitiri ye semiconductor yapinda munguva ye-post-Moore, uye maitiro epamberi haasati angotarisa kufambisira mberi kwewafer yekugadzira tekinoroji node, asi zvishoma nezvishoma kutendeukira kuhunyanzvi hwekurongedza. Yepamberi yekurongedza tekinoroji haigone kungovandudza mabasa uye kuwedzera kukosha kwechigadzirwa, asiwo zvinobudirira kuderedza mutengo wekugadzira, ichiva nzira yakakosha yekuenderera mberi neMutemo waMoore. Kune rimwe divi, iyo yakakosha tekinoroji tekinoroji inoshandiswa kupatsanura yakaoma masisitimu kuita akati wandei ekurongedza matekinoroji ayo anogona kuiswa mune heterogeneous uye heterogeneous kurongedza. Kune rimwe divi, iyo yakasanganiswa sisitimu tekinoroji inoshandiswa kubatanidza zvishandiso zvezvinhu zvakasiyana uye zvimiro, izvo zvine zvakasarudzika zvinoshanda. Iko kubatanidzwa kweakawanda mabasa uye zvishandiso zvezvinhu zvakasiyana zvinoonekwa nekushandisa microelectronics tekinoroji, uye kusimudzira kubva kumatunhu akabatanidzwa kusvika kune akabatanidzwa masisitimu anoitika.
Semiconductor packaging ndiyo yekutanga nzvimbo yekugadzira chip uye bhiriji pakati penyika yemukati yechip uye yekunze system. Parizvino, kuwedzera kune echinyakare semiconductor kurongedza uye yekuyedza makambani, semiconductorwaferfoundries, semiconductor dhizaini makambani, uye akabatanidzwa chikamu makambani ari kushingaira kugadzira epamberi ekurongedza kana ane hukama akakosha ekurongedza matekinoroji.
Iwo makuru maitiro echinyakare kurongedza tekinoroji ndeyewaferkutetepa, kucheka, kufa kubatanidza, kubatanidza waya, kuisa chisimbiso chepurasitiki, electroplating, kucheka mbabvu nekuumba, nezvimwewo Pakati pazvo, iyo kufa bonding process ndeimwe yeakaomesesa uye akakosha ekurongedza maitiro, uye kufa bonding process midziyo ndeimwe ye iyo inonyanya kukosha midziyo mu semiconductor packaging, uye ndeimwe yemidziyo yekurongedza ine mutengo wepamusoro wemusika. Kunyangwe tekinoroji yekurongedza yepamberi inoshandisa kumberi-kumagumo maitiro senge lithography, etching, metallization, uye planarization, iyo inonyanya kukosha yekurongedza ichiri kufa kwekubatanidza maitiro.
2 Semiconductor kufa bonding process
2.1 Muchidimbu
Iyo yekufa bonding process inonziwo chip loading, core loading, die bonding, chip bonding process, etc. Iyo die bonding process inoratidzwa muMufananidzo 1. Kazhinji kutaura, kufa kusungirirwa ndiko kutora chip kubva pamucheka uchishandisa welding musoro. kusveta nozzle uchishandisa vacuum, uye woiisa pane yakasarudzika padhi nzvimbo yeinotungamira furemu kana yekurongedza substrate pasi pekutungamira kwekuona, kuitira kuti chip uye padhi zvisungwe uye fixed. Hunhu uye nekubudirira kweiyo kufa bonding process inozokanganisa zvakananga kunaka uye kushanda kweiyo inotevera waya yekubatanidza, saka kufa bonding ndeimwe yeakakosha matekinoroji mune semiconductor back-end process.
Kune akasiyana semiconductor chigadzirwa kurongedza maitiro, parizvino kune matanhatu makuru ekufa bonding process tekinoroji, anoti adhesive bonding, eutectic bonding, nyoro solder bonding, sirivheri sintering bonding, inopisa kudzvanya bonding, uye flip-chip bonding. Kuti uwane yakanaka chip bonding, zvinodikanwa kuita kuti zvakakosha mashandiro ezvinhu mufa bonding process zvishande pamwe chete, kunyanya zvinosanganisira kufa bonding zvinhu, tembiricha, nguva, kudzvanywa uye zvimwe zvinhu.
2. 2 Adhesive bonding process
Munguva yekunamatira kusungirirwa, imwe chiyero chekunamira chinoda kuiswa kune inotungamira furemu kana pasuru substrate isati yaisa chip, uye ipapo iyo inofa inosunga musoro inotora chip, uye kuburikidza nemuchina kutungamira kwechiratidzo, chip chinoiswa nenzira kwayo pachisungo. chinzvimbo cheiyo inotungamira furemu kana pasuru substrate yakavharwa neadhesive, uye imwe inofa bonding simba inoiswa kune chip kuburikidza nekufa bonding muchina musoro, ichigadzira inonamira layer pakati pechip uye. iyo inotungamira furemu kana pasuru substrate, kuitira kuti uwane chinangwa chekubatanidza, kuisa uye kugadzirisa chip. Iyi die bonding process inonziwo glue bonding process nekuti chinonamira chinoda kuiswa pamberi pechinofa bonding muchina.
Anowanzo shandiswa adhesives zvinosanganisira semiconductor zvinhu zvakadai epoxy resin uye conductive sirivheri paste. Adhesive bonding ndiyo inonyanya kushandiswa semiconductor chip die bonding process nekuti maitiro acho ari nyore, mutengo wakaderera, uye zvakasiyana siyana zvinogona kushandiswa.
2.3 Eutectic bonding process
Munguva ye eutectic bonding, eutectic bonding zvinhu zvinowanzofanoiswa pazasi pe chip kana inotungamira furemu. Iyo eutectic bonding midziyo inotora chip uye inotungamirwa nemuchina wekuona sisitimu yekuisa nemazvo chip panzvimbo inoenderana yekubatana kweiyo inotungamira furemu. Iyo chip uye inotungamira furemu inoumba eutectic bonding interface pakati pe chip nepakeji substrate pasi pechiito chakasanganiswa chekudziya nekumanikidza. Iyo eutectic bonding process inowanzo shandiswa mu lead frame uye ceramic substrate packaging.
Eutectic bonding zvinhu zvinowanzosanganiswa nezvinhu zviviri pane imwe tembiricha. Zvishandiso zvinowanzoshandiswa zvinosanganisira goridhe uye tin, goridhe nesilicon, nezvimwewo. Paunenge uchishandisa eutectic bonding process, track transmission module iyo inotungamira furemu iripo ichafanopisa furemu. Kiyi yekuzadzikiswa kweiyo eutectic bonding process ndeyekuti iyo eutectic bonding material inogona kunyunguduka patembiricha iri pazasi pekunyungudika kwezvinhu zviviri zvinoumba chisungo. Kuti udzivise furemu kubva pakuva oxidized panguva ye eutectic bonding process, iyo eutectic bonding process zvakare inowanzo shandisa magasi ekudzivirira akadai sehydrogen uye nitrogen gasi rakasanganiswa kuti ripinzwe munjanji kuchengetedza inotungamira furemu.
2. 4 Soft solder bonding process
Kana yakapfava solder bonding, usati waisa chip, nzvimbo yekubatanidza pane inotungamira furemu inodhindwa uye yakatsikirirwa, kana kaviri matani, uye inotungamira furemu inoda kupiswa munjanji. Kubatsira kweiyo yakapfava solder bonding process yakanaka yekupisa conductivity, uye chakashata ndechekuti iri nyore kuita oxidize uye maitiro acho akaomarara. Inokodzera kutungamira furemu kurongedza kwemagetsi zvishandiso, senge transistor outline kurongedza.
2. 5 Silver sintering bonding process
Iyo inonyanya kuvimbisa yekubatanidza maitiro eiyo yechitatu-chizvarwa simba semiconductor chip iko kushandiswa kwesimbi particle sintering tekinoroji, iyo inosanganisa mapolymers akadai se epoxy resin inokonzeresa yekubatanidza mune conductive glue. Iyo ine yakanakisa magetsi conductivity, thermal conductivity, uye yakakwirira-tembiricha sevhisi maitiro. Iyo zvakare yakakosha tekinoroji yekuwedzera budiriro mune yechitatu-chizvarwa semiconductor packaging mumakore achangopfuura.
2.6 Thermocompression bonding process
Mukurongedzerwa kwekushandisa kwepamusoro-kuita matatu-dimensional akabatanidzwa maseketi, nekuda kwekuenderera kuderedzwa kwechip interconnect input/output pitch, bump size uye pitch, semiconductor kambani Intel yakatanga chirongwa che thermocompression bonding yepamberi diki pitch bonding application, inosunga diki. bump machipisi ane pitch ye40 kusvika 50 μm kana kunyange gumi μm. Thermocompression bonding process inokodzera chip-to-wafer uye chip-to-substrate application. Sekukurumidza nhanho dzakawanda-nhanho, iyo thermocompression bonding process inotarisana nezvinetso mukugadzirisa nyaya dzekutonga, senge tembiricha isina kuenzana uye kunyungudika kusingadzoreki kweiyo vhoriyamu solder. Munguva ye thermocompression bonding, tembiricha, kudzvanywa, chinzvimbo, nezvimwe zvinofanirwa kusangana nemazvo kutonga zvinodiwa.
2.7 Flip chip bonding process
Nheyo yeflip chip bonding process inoratidzwa muMufananidzo 2. Iyo flip mechanism inotora chip kubva pawafer uye inoipepeta 180 ° kuendesa chip. Iyo solder head nozzle inotora chip kubva paflip mechanism, uye bump direction yechip iri pasi. Mushure meiyo welding musoro muromo wasimuka kuenda kumusoro kwepakeji substrate, inodzika ichidzika kusungirira uye kugadzirisa chip pane yekurongedza substrate.
Flip chip packaging ndeye advanced chip interconnection tekinoroji uye yave iyo huru nzira yekuvandudza tekinoroji yekurongedza. Iyo ine hunhu hwehupamhi hwepamusoro, kuita kwepamusoro, kutetepa uye kupfupi, uye inogona kusangana nezvinodiwa zvekusimudzira zvevatengi zvemagetsi zvigadzirwa senge ma smartphones uye mahwendefa. Iyo flip chip bonding process inoita kuti mutengo wekurongedza udzike uye unogona kuona akaturikidzana machipisi uye matatu-dimensional kurongedza. Inoshandiswa zvakanyanya mukurongedza tekinoroji minda senge 2.5D/3D yakabatanidzwa kurongedza, wafer-level kurongedza, uye system-level kurongedza. Iyo flip chip bonding process ndiyo inonyanya kushandiswa uye inonyanya kushandiswa yakasimba kufa bonding maitiro mune yepamusoro kurongedza tekinoroji.
Nguva yekutumira: Nov-18-2024