Semiceraanofara kupaPFA Cassette, sarudzo yepamusoro yekubata wafer munzvimbo umo makemikari kuramba uye kusimba kwakakosha. Yakagadzirwa kubva kune yakakwira-kuchena Perfluoroalkoxy (PFA) zvinhu, kaseti iyi yakagadzirirwa kumirisana nemamiriro anonyanya kudiwa mukugadzirwa kwesemiconductor, kuve nechokwadi chekuchengetedza uye kutendeseka kwewafers ako.
Isingaenzaniswi Chemical ResistanceThePFA Cassetteinogadzirwa kuti ipe kupikisa kwepamusoro kune akasiyana siyana emakemikari, zvichiita kuti ive sarudzo yakakwana yemaitiro anosanganisira aggressive acids, solvents, uye mamwe makemikari ane hutsinye. Uku kusimba kwemakemikari kuramba kunovimbisa kuti kaseti inoramba yakasimba uye ichishanda kunyangwe munzvimbo dzinotyisa zvakanyanya, nekudaro ichiwedzera hupenyu hwayo uye ichideredza kudiwa kwekugara kuchitsiviwa.
High-Kuchena KuvakaSemicera'sPFA Cassetteinogadzirwa kubva ku-ultra-pure PFA zvinhu, izvo zvakakosha mukudzivirira kusvibiswa panguva yekugadzira wafer. Uku kuvaka-kuchena kwepamusoro kunoderedza njodzi yekugadzira chidimbu uye makemikari leaching, kuve nechokwadi chekuti wafers ako akadzivirirwa kubva kutsvina inogona kukanganisa kunaka kwavo.
Enhanced Durability uye PerformanceYakagadzirirwa kusimba, iyoPFA Cassetteinochengetedza kutendeseka kwayo kwechimiro pasi pekupisa kwakanyanya uye kusimba kwekugadzirisa mamiriro. Ingave yakafumurwa kune tembiricha yakanyanya kana kudzokororwa kubata, kaseti iyi inoramba iine chimiro nekuita kwayo, ichipa kuvimbika kwenguva refu munzvimbo dzinoda kugadzira.
Precision Injiniya Yekubata KwakachengetekaTheSemicera PFA Cassetteinoratidzira chaiyo engineering iyo inovimbisa yakachengeteka uye yakagadzikana wafer kubata. Imwe neimwe slot yakanyatsogadzirirwa kuchengetedza wafers munzvimbo, kudzivirira chero kufamba kana kusuduruka kunogona kukonzera kukuvara. Iyi chaiyo mainjiniya inotsigira inowirirana uye yakaringana kuiswa kwewafer, ichipa kune yakazara mashandiro ekuita.
Yakasiyana-siyana Yekushandisa Pakati peMatanhoKutenda kune yayo yepamusoro zvinhu zvinhu, iyoPFA Cassetteinochinjika zvakakwana kuti ishandiswe mumatanho akasiyana-siyana ekugadzira semiconductor. Iyo inonyanya kukodzera kunyorova etching, kemikari vapor deposition (CVD), uye mamwe maitiro anosanganisira hutsinye hwemakemikari nharaunda. Kuchinjika kwayo kunoita kuti ive chishandiso chakakosha mukuchengetedza maitiro ekuvimbika uye wafer mhando.
Kuzvipira kune Hunhu uye InnovationPaSemicera, takazvipira kupa zvigadzirwa zvinosangana nepamusoro indasitiri zviyero. ThePFA Cassetteinoenzanisira kuzvipira uku, ichipa mhinduro yakavimbika inobatanidza zvisina musono mumagadzirirwo ako ekugadzira. Imwe neimwe kaseti inodzorwa nekusimba kwemhando yehutongi kuti ive nechokwadi chekuti inosangana nemaitiro edu akaomarara, ichiunza kunaka kwaunotarisira kubva kuSemicera.
| Items | Kugadzirwa | Tsvakurudzo | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kutadza kwekutarisa pamusoro | <11-20 >4±0.15° | ||
| Electrical Parameters | |||
| Dopant | n-mhando Nitrogen | ||
| Resistivity | 0.015-0.025ohm·cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Ukobvu | 350±25 μm | ||
| Primary flat orientation | [1-100]±5° | ||
| Primary flat urefu | 47.5±1.5mm | ||
| Secondary flat | Hapana | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Bow | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Mberi(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Chimiro | |||
| Micropipe density | <1 pa/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metal tsvina | ≤5E10atomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Mberi Hunhu | |||
| Mberi | Si | ||
| Surface finish | Si-face CMP | ||
| Zvimedu | ≤60ea/wafer (saizi≥0.3μm) | NA | |
| Makwara | ≤5ea/mm. Kureba kwekuwedzera ≤Diameter | Cumulative kureba≤2*Diameter | NA |
| Orenji svuura/makomba/mavara/mitsetse/pakatsemuka/kusvibiswa | Hapana | NA | |
| Edge chips/indents/fracture/hex plates | Hapana | ||
| Polytype nzvimbo | Hapana | Cumulative area≤20% | Cumulative area≤30% |
| Front laser marking | Hapana | ||
| Back Quality | |||
| Back finish | C-chiso CMP | ||
| Makwara | ≤5ea/mm,Cumulative kureba≤2*Diameter | NA | |
| Kuremara kumashure (kumucheto machipisi / indents) | Hapana | ||
| Back roughness | Ra≤0.2nm (5μm*5μm) | ||
| Back laser marking | 1 mm (kubva kumusoro kumucheto) | ||
| Edge | |||
| Edge | Chamfer | ||
| Packaging | |||
| Packaging | Epi-yakagadzirira ine vacuum packaging Multi-wafer kaseti kurongedza | ||
| * Notes: "NA" zvinoreva kuti hapana chikumbiro Zvinhu zvisina kutaurwa zvinogona kureva SEMI-STD. | |||
