Silicon Film

Tsanangudzo Pfupi:

Iyo Silicon Firimu naSemicera ndeyepamusoro-inoshanda zvinhu zvakagadzirirwa akasiyana emhando yepamusoro maapplication mune semiconductor uye zvemagetsi maindasitiri. Yakagadzirwa kubva kusilicon yemhando yepamusoro, firimu iri rinopa kufanana kwakasiyana, kugadzikana kwemafuta, uye zvivakwa zvemagetsi, zvichiita kuti ive mhinduro yakanaka kune yakaonda-firimu deposition, MEMS (Micro-Electro-Mechanical Systems), uye semiconductor mudziyo wekugadzira.


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Iyo Silicon Firimu naSemicera ndeyepamusoro-mhando, yakanyatso-engineered zvinhu zvakagadzirirwa kuzadzisa zvinoomesesa zvinodiwa zveiyo semiconductor indasitiri. Yakagadzirwa kubva kusilicon yakachena, iyi yakaonda-firimu mhinduro inopa yakanakisa kufanana, kuchena kwepamusoro, uye yakasarudzika magetsi uye ekupisa zvivakwa. Yakanakira kushandiswa mune akasiyana semiconductor application, kusanganisira kugadzirwa kweSi Wafer, SiC Substrate, SOI Wafer, SiN Substrate, uye Epi-Wafer. Semicera's Silicon Firimu inovimbisa kuita kwakavimbika uye kunoenderana, zvichiita kuti ive chinhu chakakosha kune advanced microelectronics.

Hunhu Hwepamusoro uye Kuita kweSemiconductor Manufacturing

Semicera's Silicon Firimu inozivikanwa nekuda kwesimba rayo rakatanhamara remuchina, kugadzikana kwakanyanya kwemafuta, uye kuderera kwemazinga, izvo zvakakosha mukugadzirwa kweakakwira-performance semiconductors. Ingave yakashandiswa mukugadzirwa kweGallium Oxide (Ga2O3) zvishandiso, AlN Wafer, kana Epi-Wafers, iyo firimu inopa hwaro hwakasimba hwekuonda-firimu deposition uye epitaxial kukura. Kuenderana kwayo nemamwe semiconductor substrates seSiC Substrate uye SOI Wafers inovimbisa kusanganisa isina musono mumagadzirirwo aripo ekugadzira, zvichibatsira kuchengetedza goho repamusoro uye inowirirana mhando yechigadzirwa.

Zvishandiso muSemiconductor Indasitiri

Muindasitiri yesemiconductor, Semicera's Silicon Firimu rinoshandiswa mumhando dzakasiyana dzekushandisa, kubva mukugadzirwa kweSi Wafer uye SOI Wafer kune mamwe mashandisirwo ane hunyanzvi seSiN Substrate uye Epi-Wafer kusikwa. Kuchena kwepamusoro uye kurongeka kwefirimu iri kunoita kuti ive yakakosha mukugadzirwa kwezvinhu zvepamberi zvinoshandiswa mune zvese kubva kumamicroprocessors uye maseketi akabatanidzwa kune optoelectronic zvishandiso.

Iyo Silicon Firimu inoita basa rakakosha mune semiconductor maitiro senge epitaxial kukura, wafer bonding, uye nhete-firimu deposition. Zvivakwa zvaro zvinovimbika zvinonyanya kukosha kune maindasitiri anoda zvakanyanya kudzorwa nharaunda, senge dzimba dzakachena mune semiconductor machira. Pamusoro pezvo, iyo Silicon Firimu inogona kubatanidzwa mumakaseti masisitimu ekubata zvakanaka wafer kubata uye kutakura panguva yekugadzira.

Kuvimbika Kwenguva Yakareba uye Kuenderana

Imwe yemabhenefiti akakosha ekushandisa Semicera's Silicon Firimu kuvimbika kwayo kwenguva refu. Nekusimba kwayo kwakaringana uye kunoenderana mhando, iyi firimu inopa mhinduro yakavimbika kune yakakwirira-vhoriyamu yekugadzira nharaunda. Kunyangwe ichishandiswa mumhando yepamusoro-chaiyo semiconductor zvishandiso kana zvepamberi zvemagetsi zvikumbiro, Semicera's Silicon Firimu inova nechokwadi chekuti vagadziri vanokwanisa kuwana kuita kwepamusoro uye kuvimbika pane dzakasiyana siyana zvigadzirwa.

Sei Kusarudza Semicera's Silicon Firimu?

Iyo Silicon Firimu kubva kuSemicera chinhu chakakosha chekucheka-kumucheto mashandisirwo muindasitiri yesemiconductor. Yayo yepamusoro-inoshanda zvivakwa, zvinosanganisira yakanakisa kugadzikana kwemafuta, kuchena kwepamusoro, uye simba remuchina, inoita kuti ive sarudzo yakanaka kune vagadziri vari kutsvaga kuwana iyo yepamusoro miitiro mukugadzira semiconductor. Kubva kuSi Wafer uye SiC Substrate kusvika mukugadzirwa kweGallium Oxide Ga2O3 zvishandiso, firimu iri rinoburitsa isingaenzaniswi mhando nekuita.

NeSemicera's Silicon Firimu, unogona kuvimba nechigadzirwa chinosangana nezvinodiwa zvemazuva ano semiconductor kugadzira, ichipa hwaro hwakavimbika hwechizvarwa chinotevera chemagetsi.

Items

Kugadzirwa

Tsvakurudzo

Dummy

Crystal Parameters

Polytype

4H

Kutadza kwekutarisa pamusoro

<11-20 >4±0.15°

Electrical Parameters

Dopant

n-mhando Nitrogen

Resistivity

0.015-0.025ohm·cm

Mechanical Parameters

Diameter

150.0±0.2mm

Ukobvu

350±25 μm

Primary flat orientation

[1-100]±5°

Primary flat urefu

47.5±1.5mm

Secondary flat

Hapana

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Bow

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Mberi(Si-face) roughness(AFM)

Ra≤0.2nm (5μm*5μm)

Chimiro

Micropipe density

<1 pa/cm2

<10 ea/cm2

<15 ea/cm2

Metal tsvina

≤5E10atomu/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Mberi Hunhu

Mberi

Si

Surface finish

Si-face CMP

Zvimedu

≤60ea/wafer (saizi≥0.3μm)

NA

Makwara

≤5ea/mm. Kureba kwekuwedzera ≤Diameter

Cumulative kureba≤2*Diameter

NA

Orenji svuura/makomba/mavara/mitsetse/pakatsemuka/kusvibiswa

Hapana

NA

Edge chips/indents/fracture/hex plates

Hapana

Polytype nzvimbo

Hapana

Cumulative area≤20%

Cumulative area≤30%

Front laser marking

Hapana

Back Quality

Back finish

C-chiso CMP

Makwara

≤5ea/mm,Cumulative kureba≤2*Diameter

NA

Kuremara kumashure (kumucheto machipisi / indents)

Hapana

Back roughness

Ra≤0.2nm (5μm*5μm)

Back laser marking

1 mm (kubva kumusoro kumucheto)

Edge

Edge

Chamfer

Packaging

Packaging

Epi-yakagadzirira ine vacuum packaging

Multi-wafer kaseti kurongedza

* Notes: "NA" zvinoreva kuti hapana chikumbiro Zvinhu zvisina kutaurwa zvinogona kureva SEMI-STD.

tech_1_2_size
SiC wafers

  • Zvakapfuura:
  • Zvinotevera: