Semicera Silicon Wafers akagadzirwa zvine hungwaru kuti ashande sehwaro hwehuwandu hwakawanda hwema semiconductor zvishandiso, kubva ku microprocessors kuenda kune photovoltaic maseru. Aya mawafer akagadzirwa nehupamhi hwepamusoro uye kuchena, kuve nechokwadi chekushanda kwakakwana mumhando dzakasiyana dzemagetsi ekushandisa.
Yakagadzirwa ichishandisa hunyanzvi hwepamberi, Semicera Silicon Wafers inoratidza kupfava kwakasarudzika uye kufanana, izvo zvakakosha kuti uwane goho rakakura mukugadzira semiconductor. Iyi nhanho yehutsanana inobatsira mukudzikisa kukanganisa uye nekuvandudza kushanda kwese kwemagetsi zvikamu.
Hunhu hwepamusoro hweSemicera Silicon Wafers hunoonekwa mune yavo yemagetsi maitiro, ayo anobatsira mukusimudzirwa kwekuita kwesemiconductor zvishandiso. Nemazinga akaderera ehutsvina uye yakakwirira yekristaro mhando, aya mawafer anopa yakanakira chikuva chekugadzira-yepamusoro-inoshanda zvemagetsi.
Inowanikwa muhukuru hwakasiyana uye zvirevo, Semicera Silicon Wafers inogona kugadzirwa kuti isangane nezvinodiwa chaizvo zvemaindasitiri akasiyana, kusanganisira komputa, nharembozha, uye simba rinodzokororwa. Ingave yekugadzira-hombe-yekugadzira kana tsvakiridzo yakasarudzika, mawaferi aya anopa mhedzisiro yakavimbika.
Semicera yakazvipira kutsigira kukura uye kuvandudza kweiyo semiconductor indasitiri nekupa emhando yepamusoro silicon wafers inosangana nepamusoro indasitiri zviyero. Nekutarisa pakurongeka uye kuvimbika, Semicera inogonesa vagadziri kusundira miganhu yetekinoroji, vachiona kuti zvigadzirwa zvavo zvinogara kumberi kwemusika.
| Items | Kugadzirwa | Tsvakurudzo | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kutadza kwekutarisa pamusoro | <11-20 >4±0.15° | ||
| Electrical Parameters | |||
| Dopant | n-mhando Nitrogen | ||
| Resistivity | 0.015-0.025ohm·cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Ukobvu | 350±25 μm | ||
| Primary flat orientation | [1-100]±5° | ||
| Primary flat urefu | 47.5±1.5mm | ||
| Secondary flat | Hapana | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Bow | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Mberi(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Chimiro | |||
| Micropipe density | <1 pa/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metal tsvina | ≤5E10atomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Mberi Hunhu | |||
| Mberi | Si | ||
| Surface finish | Si-face CMP | ||
| Zvimedu | ≤60ea/wafer (saizi≥0.3μm) | NA | |
| Makwara | ≤5ea/mm. Kureba kwekuwedzera ≤Diameter | Cumulative kureba≤2*Diameter | NA |
| Orenji svuura/makomba/mavara/mitsetse/pakatsemuka/kusvibiswa | Hapana | NA | |
| Edge chips/indents/fracture/hex plates | Hapana | ||
| Polytype nzvimbo | Hapana | Cumulative area≤20% | Cumulative area≤30% |
| Front laser marking | Hapana | ||
| Back Quality | |||
| Back finish | C-chiso CMP | ||
| Makwara | ≤5ea/mm,Cumulative kureba≤2*Diameter | NA | |
| Kuremara kumashure (kumucheto machipisi / indents) | Hapana | ||
| Back roughness | Ra≤0.2nm (5μm*5μm) | ||
| Back laser marking | 1 mm (kubva kumusoro kumucheto) | ||
| Edge | |||
| Edge | Chamfer | ||
| Packaging | |||
| Packaging | Epi-yakagadzirira ine vacuum packaging Multi-wafer kaseti kurongedza | ||
| * Notes: "NA" zvinoreva kuti hapana chikumbiro Zvinhu zvisina kutaurwa zvinogona kureva SEMI-STD. | |||
