Semicera inopa indasitiri inotungamiraWafer Carriers, yakagadzirwa kuti ipe dziviriro yepamusoro uye yekufambisa isina musono yeakapfava semiconductor wafer mumatanho akasiyana ekugadzira. YeduWafer Carriersdzakagadzirwa zvine hungwaru kuti isangane nezvinoda kuomesesa zvemazuva ano semiconductor kugadzirwa, kuve nechokwadi chekuti kutendeseka uye mhando yewafers yako inochengetwa nguva dzese.
Zvinokosha:
• Premium Material Construction:Yakagadzirwa kubva kumhando yepamusoro, inodzivirira kusvibiswa zvinhu zvinovimbisa kusimba uye hupenyu hurefu, zvichiita kuti ive yakakodzera kune dzakachena nharaunda.
•Precision Dhizaini:Inoratidzira chaiyo slot alignment uye yakachengeteka kubata nzira dzekudzivirira wafer kutsvedza uye kukuvadzwa panguva yekubata nekufambisa.
•Versatile Compatibility:Inogashira huwandu hwakasiyana hwewafer saizi uye ukobvu, ichipa kuchinjika kune akasiyana semiconductor application.
•Ergonomic Handling:Huremu uye mushandisi-ushamwari dhizaini inofambisa kurodha uye kurodha zviri nyore, inosimudzira kushanda zvakanaka uye kuderedza kubata nguva.
•Customizable Options:Inopa kugadzirisa kuti isangane nezvinodiwa chaizvo, zvinosanganisira sarudzo yezvinhu, saizi kugadzirisa, uye kunyora mazita ekubatanidza kufambiswa kwebasa.
Wedzera yako semiconductor yekugadzira maitiro neSemicera'sWafer Carriers, mhinduro yakakwana yekuchengetedza mawafers ako kubva pakusvibiswa uye kukuvara kwemuchina. Vimba nekuzvipira kwedu kune mhando uye hunyanzvi kuendesa zvigadzirwa zvisingangosangana chete asi zvinopfuura zviyero zveindasitiri, kuve nechokwadi chekuti mashandiro ako anofamba zvakanaka uye nemazvo.
| Items | Kugadzirwa | Tsvakurudzo | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Kutadza kwekutarisa pamusoro | <11-20 >4±0.15° | ||
| Electrical Parameters | |||
| Dopant | n-mhando Nitrogen | ||
| Resistivity | 0.015-0.025ohm·cm | ||
| Mechanical Parameters | |||
| Diameter | 150.0±0.2mm | ||
| Ukobvu | 350±25 μm | ||
| Primary flat orientation | [1-100]±5° | ||
| Primary flat urefu | 47.5±1.5mm | ||
| Secondary flat | Hapana | ||
| TTV | ≤5 μm | ≤10 μm | ≤15 μm |
| LTV | ≤3 μm(5mm*5mm) | ≤5 μm(5mm*5mm) | ≤10 μm(5mm*5mm) |
| Bow | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤35 μm | ≤45 μm | ≤55 μm |
| Mberi(Si-face) roughness(AFM) | Ra≤0.2nm (5μm*5μm) | ||
| Chimiro | |||
| Micropipe density | <1 pa/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Metal tsvina | ≤5E10atomu/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Mberi Hunhu | |||
| Mberi | Si | ||
| Surface finish | Si-face CMP | ||
| Zvimedu | ≤60ea/wafer (saizi≥0.3μm) | NA | |
| Makwara | ≤5ea/mm. Kureba kwekuwedzera ≤Diameter | Cumulative kureba≤2*Diameter | NA |
| Orenji svuura/makomba/mavara/mitsetse/pakatsemuka/kusvibiswa | Hapana | NA | |
| Edge chips/indents/fracture/hex plates | Hapana | ||
| Polytype nzvimbo | Hapana | Cumulative area≤20% | Cumulative area≤30% |
| Front laser marking | Hapana | ||
| Back Quality | |||
| Back finish | C-chiso CMP | ||
| Makwara | ≤5ea/mm,Cumulative kureba≤2*Diameter | NA | |
| Kuremara kumashure (kumucheto machipisi / indents) | Hapana | ||
| Back roughness | Ra≤0.2nm (5μm*5μm) | ||
| Back laser marking | 1 mm (kubva kumusoro kumucheto) | ||
| Edge | |||
| Edge | Chamfer | ||
| Packaging | |||
| Packaging | Epi-yakagadzirira ine vacuum packaging Multi-wafer kaseti kurongedza | ||
| * Notes: "NA" zvinoreva kuti hapana chikumbiro Zvinhu zvisina kutaurwa zvinogona kureva SEMI-STD. | |||
